| 1.Introduction |
The laser scribing machine is specially designed for insulation of a-Si (amorphous silicon) and back contacts such as aluminum coating of the a-Si thin-film solar cell, without any damage to TCO (transparent conductive oxidization) coating.
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| 2. Features |
| ¡ñ CNC worktable size: 900mm ¡Á 1600mm |
| ¡ñ High-speed up to 500 mm/s or 200 ¡Á 4 |
| ¡ñ Auto programming / cooling / on-off |
| ¡ñ Kerfs width 0.05 ¨C 0.15 mm, continuously adjustable |
| 3. Technical Parameters |
| Wavelength |
532 nm |
| Laser output stability |
¡Ü ¡À 3% |
| Beam expanded angle |
¡Ü 8 mrad |
| Scribing speed |
Continuously adjustable, max 250mm/s |
| Kerf width |
Continuously adjustable, 0.05 - 0.15 mm |
| Scribing area |
900 mm ¡Á 1600 mm |
| Power supply |
Single-phase AC 220V ¡À 10%,50 Hz /60 Hz,PE,(A voltage stabilizer might be required to avoid irregular cutting quality caused by severe voltage fluctuation) |
| Input power |
Max 1500W |
| Cooling Mode |
Air cooling |
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| 4.Standard Configuration |
| Laser machine ¡Á 1 set |
| Worktable unit (CNC controller) ¡Á 1 set |
| PC ¡Á 1 set |
| Scribing software (In English) ¡Á 1 set |
| Operation manual (In English) ¡Á 1 |
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